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Breakthrough BMC Mould Molding Technology Optimizes Thermoset Production

Prosperity Technology Development Co., Ltd. today announces its next-generation BMC Mould Molding platform, engineered to meet the rising demand for durable thermoset components. By integrating advanced SMC compounding, optimized UP resin formulations and industry-leading Injection molding BMC processes, the new system delivers uniform part quality, consistent cycle times and minimal waste. From high-voltage electrical switches to complex automotive under-hood brackets, the solution covers the full spectrum of Package BMC compression molding uses.

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SMC Insert Mould Solutions for High-Performance Thermosetting Components

Part name:Electric iron and electrical switch Material:SMC/BMC Mould type: Thermoset Mold Cavity&Core: H13 Mould base: LKM Cold runner: Edge gate Tolerance: +/-0.2mm

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